Preparation technologies

• electron-beam lithography
• mask design
• optical contact lithography
• sputter deposition of superconductors and ferromagnets
• plasma enhanced chemical vapor deposition (PECVD)
• plasma etching (plate-parallel reactor, ion beam, reactive ion etching)
• metalization (thermal and electron-beam evaporation)
• mechanical and chemical polishing
• contact bonding
• anodic oxidation